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EPO-LIDS™

We offer ceramic lids that match all of our ceramic packages for RF power devices.

Our patented Epo-Lids™ are available in a wide variety of sizes and shapes.

Shapes Available
     > Square    > Rectangle    > Circular    > Plates or cups

Lid Sizes Available
     From 0.16" x 0.16" to 2.0" x 2.0"

Cup Lip Topography
     > Plain    > Notches    > Bumps

With over 15 years of experience in RF and microwave packaging, Materion offers epoxy coated lids to meet your needs.

  • Our superior quality MEG-150 epoxy has an extended shelf life that will contribute to longer use & profitability.  View more on Epoxy MEG-150 and Epoxy MEG -165
  • Provides a seal that meets or exceeds gross leak hermeticity
  • B-stage epoxy is not tacky prior to cure
  • Lids are available as ceramic (alumina) or metal (plated Kovar)
  • We are tooled for over 75 epoxy-coated lids in a variety of shapes and sizes
  • Our engineers will partner with you to manufacture new lid designs to enable your specific designs

    Please CONTACT US for assistance with your lid requirements.

PRODUCT LINE

Materion's other packaging products include:

  > Combo-Lids™     > Seam Seal-Lids™   
  > Micro-Lids™     > Solder Reflow-Lids™  
  > Visi-Lids™     > Metal Lids  
  > Cu-Packs™     > Ceramic packages