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We offer ceramic lids that match all of our ceramic packages for RF power devices.

Our patented Epo-Lids™ are available in a wide variety of sizes and shapes.

Shapes Available
     > Square    > Rectangle    > Circular    > Plates or cups

Lid Sizes Available
     From 0.16" x 0.16" to 2.0" x 2.0"

Cup Lip Topography
     > Plain    > Notches    > Bumps

With over 15 years of experience in RF and microwave packaging, Materion offers epoxy coated lids to meet your needs.

  • Our superior quality MEG-150 epoxy has an extended shelf life that will contribute to longer use & profitability.  View more on Epoxy MEG-150 and Epoxy MEG -165
  • Provides a seal that meets or exceeds gross leak hermeticity
  • B-stage epoxy is not tacky prior to cure
  • Lids are available as ceramic (alumina) or metal (plated Kovar)
  • We are tooled for over 75 epoxy-coated lids in a variety of shapes and sizes
  • Our engineers will partner with you to manufacture new lid designs to enable your specific designs

    Please CONTACT US for assistance with your lid requirements.


Materion's other packaging products include:

  > Combo-Lids™     > Seam Seal-Lids™   
  > Micro-Lids™     > Solder Reflow-Lids™  
  > Visi-Lids™     > Metal Lids  
  > Cu-Packs™     > Ceramic packages