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EPOXY MEG 150 AND MEG 165

Epoxy with strong reliable adhesion for your non-hermetic applications, especially in combination with our Epo-Lids™.  MEG 150 It is typically used to bond cup-shaped ceramic caps onto ceramic packages for RF transistors. MEG 165 is optimal for sealing smooth, flat surfaces and serves as a low cost alternative to solder.

Both are excellent electrical insulators, and protect electrical components from short circuiting, dust and moisture. For more information, see our Technical Data Sheets MEG 150 and MEG 165.

CONTACT MATERION!
OUR HIGH PERFORMANCE EPOXIES PROTECT CRITICAL ELECTRICAL COMPONENTS!

ADVANTAGES OF MATERION EXPOXIES

Our superior performing products enable durable adhesion for the lifecycle of your product. 

MEG 150 Epoxy offers these benefits:

  • Standard thickness 0.009” ±0.0005” ( 230 μm) over the entire seal surface
  • Epoxy is supplied B-staged and is not tacky prior to curing
  • Excellent adhesion to alumina and plated gold
  • During curing, epoxy will flow to provide good conformability to leads, bumps and notches
  • Cured epoxy will pass gross leak hermetic testing

MEG 165 Epoxy offers these benefits:

  • Standard thickness 0.003" ±0.0005” ( 76 μm) over the entire seal surface
  • Epoxy is supplied B-staged and is not tacky prior to curing
  • Excellent adhesion to alumina and plated gold
  • During curing, epoxy will flow to seal two flat, smooth surfaces
  • Cured epoxy will pass gross leak hermetic testing