Laser Ablation of Deposited Coatings

• Ablation of metal or dielectric thin films
• Coating line widths down to 20 µm
• Gaps between lines down to 20 µm
• Workpiece size up to 21” x 24”(533mm x 610 mm)

Laser ablated thin film Au on a 1” Si wafer; gold lines down to 20 µm wide