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Ceramic Packages


  1. PDF Document BondFlow Adhesive

    Learn more about BondFlow, a user-friendly adhesive that can be spin-coated or printed onto a wide variety of surfaces found in MEMS applications.

  2. PDF Document CA-Pack™ Information Sheet

  3. PDF icon CuPacks™ Power RF Packages Information Sheet

    Our unique CuPacks deliver outstanding performance for very low thermal resistance and very low RF loss.

  4. PDF icon Epo-Lids™ Information Sheet

    Materion now offers epoxy-coated ceramic and metal lids to complement our existing products and meet specific customer requirements.

  5. PDF icon MEG 150 Epoxy Data Sheet

  6. PDF icon MEG 165 Epoxy Data Sheet