Home Resource Center Product Data and Related Literature Microelectronics Packaging Materials Ceramic Packages Ceramic Packages Resources BondFlow Adhesive Learn more about BondFlow, a user-friendly adhesive that can be spin-coated or printed onto a wide variety of surfaces found in MEMS applications. CA-Pack™ Information Sheet CuPacks™ Power RF Packages Information Sheet Our unique CuPacks deliver outstanding performance for very low thermal resistance and very low RF loss. Epo-Lids™ Information Sheet Materion now offers epoxy-coated ceramic and metal lids to complement our existing products and meet specific customer requirements. Hybrid CA-Pack MEG 150 Epoxy Data Sheet MEG 165 Epoxy Data Sheet