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Ceramic Packages


  1. PDF Document BondFlow Adhesive

    Learn more about BondFlow, a user-friendly adhesive that can be spin-coated or printed onto a wide variety of surfaces found in MEMS applications.

  2. PDF Document CA-Pack™ Information Sheet

  3. PDF icon CuPacks™ Power RF Packages Information Sheet

    Our unique CuPacks deliver outstanding performance for very low thermal resistance and very low RF loss.

  4. PDF icon Epo-Lids™ Information Sheet

    Materion now offers epoxy-coated ceramic and metal lids to complement our existing products and meet specific customer requirements.

  5. PDF Document Hybrid CA-Pack

  6. PDF icon MEG 150 Epoxy Data Sheet

  7. PDF icon MEG 165 Epoxy Data Sheet