Home Resource Center Technical Papers Beryllium Metal Bonding and Brazing Bonding & Brazing Resources Bonding Beryllium to Aluminum-Beryllium (AlBeMet®) and to Copper Alloys Results Materion Beryllium & Composites’ novel approach to bonding beryllium to aluminum beryllium (AlBeMet®) and to copper alloys provides superior bond strength. CS-2 Bond Test Data Adhesive bonding test data for aluminum-beryllium coupons shows consistently superior results. Joining II - Brazing and Soldering The requirement for improved heat resistance in lightweight structures lends itself naturally to brazing. Metallurgical joining of the unique material, beryllium, enables structural engineers and designers to avail themselves of efficient material utilization. This chapter section will discuss low-temperature brazing (soldering), medium-temperature brazing using aluminum-base filters, and high-temperature brazing using silver-base fillers. Joining I - Mechanical / Adhesive Due to beryllium’s light weight and extraordinary stiffness, the metal is unrivaled for use in spacecrafts and other systems where weight savings are an important consideration. Utilizing proper methods when constructing structural joints maximizes the usefulness of beryllium structures.