RF Packaging Technical Papers
Find detailed technical data in our latest technical papers for next-generation RF packaging and microwave circuits.
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- Next-Generation RF Packaging GenPack(TM) - Technical Paper
Learn more about Next-Generation High Powered RF and Optical Packages, presenting GenPack(TM) innovation from Materion engineers.
- High Power RF Packaging and Microwave Circuits Powering Advanced Transportation - Whitepaper
Materion' s new technology delivers high performance RF packaging and optical device solutions with a variety of advanced material options.