Getter Combo-Lids

Materion provides a unique solution to trapped gas within hermetic packaging using our unique Getter Combo-Lid ™ covers. This product combines our popular Combo-Lid covers enhanced with a getter appropriate to the application. Getter is a material formulation that is applied for the purpose of absorbing gases within an enclosed cavity. In combining the two lids, Getter Combo-Lids resolve the issue of gas entrapped within a package that negatively impacts electrical performance.

Certain applications are especially dependent on high reliability functioning, such as specific GaAs electronic devices, MEMS devices and other delicate sensors. To function successfully, they must be hermetically packaged within a sealed cavity that is completely free of hydrogen or other gases. Failure to eliminate all gases, particularly hydrogen in GaAs devices, can cause degradation in long term functionality of your product or device.

GETTERING OPTIONS AVAILABLE BASED ON APPLICATION

Whether solder lids require gettering hydrogen alone or needs to eliminate all gases (except for noble gases), we have a solution for ultimate hermeticity.

For gettering hydrogen:
Materion can weld a getter foil to the ceiling of the metal cover lid. This foil will getter hydrogen but is not affected by the ambient nitrogen used to reflow the AuSn solder during lid sealing.

For gettering all gases (except noble gases):
Thin film NanoGetters™ technology is deposited onto the ceiling of a metal or ceramic cover lid. The getter is activated during the reflow of AunSn solder to seal the lid. A Combo-Lid cover enhanced with NanoGetter should be sealed in an ambient of vacuum or argon so it can preserve the vacuum in the sealed cavity.

NanoGetters is a thin film getter solution that uses proprietary materials and processes to eliminate stray gases trapped within MEMS device packaging. Materion's patented getter technology is particle-free and offers a better alternative to traditional non-evaporative getter technology.

TOTAL SOLUTION FOR WAFER LEVEL PACKAGING

Materion has taken an integrated approach to the manufacturing of cap wafers for the wafer level packaging (WLP) of optical sensing devices. Materion can provide optical coatings, solderable metallization and getter technology under one roof. This provides customers with an all-inclusive, turnkey service that was previously unavailable in the market.

GETTER TECHNOLOGY EXCEEDS EXPECTATIONS

NanoGetters technology is used to improve vacuum packaging in a wide range of applications including microbolometers, chemical sensors, microfluidic devices and other electronic devices. NanoGetters materials are applied to a surface inside the vacuum cavity of the MEMS device. After vacuum sealing, it can absorb remaining gases that were trapped or desorbed from the walls of the package.

LOW TEMPERATURE LID SEALING

While it is critical that semiconductor packages have a reliable hermetic cover to protect sensitive electrical components, some chips will not tolerate high temperatures during soldering. Therefore, a low temperature seam sealing process is required. Materion provides innovation with the Etch Lid™ cover, a solution for hermetic applications where semiconductor chips are unable to withstand solder reflow temperatures inside an oven.

SEAM WELDING PROCESS IMPROVES STRENGTH

Etch Lid lids are used in the seam welding process to melt and fuse the thinner edges of the lids onto a metal seal ring, and made with Kovar, steel and other alloys. This concentrates the greatest heat at the perimeter of the lid, to enable a weld onto the metal seal ring. Alternatively, Materion can attach a solder preform onto the outer lip of the lid, to allow solder reflow to the sealing surface. The insertion of a solder enables a wider range of lid materials (including Mo) and a wider range of sealing surfaces to be used, such as metallized ceramic.

YOUR CHOICE OF MATERIALS TO MINIMIZE COST

While gold-tin solder alloys create a superior hermetic seal without flux, customers may prefer a lid with minimal precious metal material to reduce cost. Materion produces several solder alloys to achieve optimal packaging solutions for your application, without compromising hermeticity. We have the technical expertise to design and manufacture Etch Lids™ and Solder Frames directly from your drawing or specifications. Consult with our technical experts today.

MINI LIDS FOR BIG MICROELECTRONIC APPLICATIONS

Materion's specialized lids are designed to protect heat sensitive electronics for the ultimate hermeticity. We provide customized solder, plating and clad properties to meet your specific requirements. Our proprietary lid designs are branded as Seam Seal-Lid™ covers and Solder Reflow-Lid™ covers with technical advantages.

Seam Seal-Lid™ Covers

These solder lids used in the assembly of hermetic packages are developed as an electroless Nickel-plated lids with features including:

• Typical dimensions for standard lids range from .50 square inches to .060 square inches
• Base metal is Kovar or Alloy 42 for high performance
• A42 is plated with 50-200 micro inches of electroless nickel
• Highly corrosion-resistant for maximum protection
• Vast tool library for stamping lids in a variety of shapes and sizes

Solder Reflow-Lid™ Covers

These solder lids used in the assembly of hermetic packages are composed with non-precious metal solders and characteristics, including:

• Typically used for lids that measure less than .200” x .200”
• Solder coverage controlled to the lid edge, easily passing gross leak tests
• Adjustable to accommodate lead-free solders
• An economic alternative to our traditional Combo-Lid cover, providing the same quality