Literature

Crawford ToughMet Alloy Comparison White Paper

Reliability is essential for micro-electromechanical systems (MEMS) constantly threatened by environmental, material, and electrical inputs that can disrupt the performance of the entire module.

Advanced thermal interface materials are playing a greater role in thermal management for advanced electronics.

Mxology Validation Of Materion Alloys White Paper

Stress Corrosion Cracking / Sulfide Stress Cracking Testing in NACE MR0175 and ASTM G36 Environments of CopperBeryllium Alloys

ToughMet Sucker Rod Couplings White Paper

A Deep Dive into Advanced Materials for Next-Gen Batteries

White paper on using beryllium composite heat sinks for advanced electronic packaging