Home Products Microelectronics Packaging Materials Hermetic Packaging Lids Visi-Lids™ VISI-LID™ MEETS DEMAND FOR AN OPTICAL COVER LID Materion developed this unique hermetic lid for customers who required a window in their microelectronic packaging. Visi-Lid is the first commercially available hermetic optical cover lid assembly, and represents our leading-edge solution for light-sensitive requirements for electronic devices. ENABLING TECHNOLOGY FOR OPTICAL PACKAGE DESIGN View technical information on optical assembly, window materials, anti-reflective coatings and select solders for our high-quality Visi-Lids™. ADVANTAGES OF OPTICAL HERMETIC LIDs Our Visi-Lid , with its integral window, enables it to be used for microelectronic packaging that other lids cannot. It is employed for a wide range of industry applications that require light-sensitivity to function such as semiconductor, MEMS, laser diodes, sensoring devices, CMOS chips, and more. The advantages of choosing Visi-Lids include: Complete packaging solution for visible, infrared or ultraviolet light can be customized to meet customer transmission requirements Window materials can be sapphire, germanium, silicon or other materials High performance and quality for hermetic package sealing Anti-reflective coatings or filter coatings can be designed for specific transmission requirements Variety of solder alloys and preforms available to tack-weld to the frame of the Visi-Lid thus simplifying assembly onto your detector housing Materion provides customer support from custom-design of Visi-Lid through final assembly. Contact our engineering team to assist with your optical cover lid or any microelectronic packaging needs.