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Combo-Lid™

Materion’s Combo-Lid™ is a leading choice for hermetic microelectronic packages.

When you need cover lids for high reliability applications in semiconductor, MEMS, crystal oscillator, medical and optical devices, our unique patented Combo-Lids™ can function in the harshest service environments.

Top of Combo Lid Illustration

The base metal of our high performance Combo-Lids™ is Kovar™ or Alloy 42, which is plated with nickel and gold flash, and tack-welded to a solder perform, usually AuSn eutectic. The nickel layer inhibits corrosion, while the precious metal (gold) layer promotes solderability and ensures a clean particulate-free surface.  Tack-welding the solder preform to the lid conveniently aligns the solder to the perimeter of the lid, simplifying handling and reducing part count.  Therefore, Hermetic Combo-Lids™ offer a best-cost solution.

Lid Composition

  • Length & width dimension tolerance +/-.003"
  • Thickness dimension tolerance is +/-.001" with Flatness <.001" for="" lids=""><.500" or="" .002="" for="" lids="">.500", burrs <>

Lid Frame

  • Length & width dimension tolerance +/-.003"
  • Thickness dimension tolerance +/-.0003"

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    CONTACT US for personalized assistance on lid and frame composition, mechanisms for sealing hermetic microelectronic packaging and design guidelines.

MATERION ADVANTAGE

We employ unique capabilities to design and produce hermetically sealed packages.

  • Lids and preforms are also available individually   
  • Our engineers assist you with customized designs for cover lid, frame size and related tooling
  • We produce Combo-Lid™ products in the USA, Singapore and the Philippines for near-source distribution
  • We recommend process parameters for hermetic seals that ensure maximum assembly line yields