Home Products Clad Metals eStainless® Clad Thermal Management Materials ESTAINLESS® STEEL: CONDUCTIVE STAINLESS MATERIAL FOR ELECTRONICS With each release of the latest handheld electronics, consumers have come to expect additional and enhanced functionality, more powerful chipsets, and greater durability in devices that are also smaller and thinner. To maintain a competitive edge, product development teams need to find materials that enable or enhance next-generation technologies while managing the heat that these devices generate. eStainless materials are thermally conductive, fully formable clad laminates of stainless steel and copper (SUS/Cu/SUS). The materials are ideal as high conductivity replacements for stainless steels, allowing heat spreading functionality to be designed directly into the structure of devices. Integrated heatsinks made of eStainless steel reduce the need to add specialty thermal management solutions, saving both costs and internal device space. eStainless steel materials are a better alternative to steels commonly used for frames, brackets, chassis and housings in electronics. With 12 to 18 times higher thermal conductivity than steel – and similar strength and stiffness properties – eStainless steel materials can be integrated as a drop-in replacement with existing components. Download the eStainless Steel Data Sheet to learn more. ESTAINLESS® STEEL STREAMLINES THERMAL MANAGEMENT Our eStainless steel materials serve a dual purpose in handheld devices, enabling thin, stiff, structural components that also conduct and dissipate heat. Compare the properties of eStainless Steel to commonly used steel, copper and steel and graphite solutions commonly used in electronics design. WATCH THE HEAT SPREADING PERFORMANCE OF ESTAINLESS STEEL eStainless Steel – Copper Reduce z-height vs. stainless steel + graphite Superior heat spreading properties Mechanical performance rivaling solid steel Contact our engineers to learn how eStainless steel can solve your thermal management challenges.