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ESTAINLESS® CLAD: THERMAL AND STRUCTURAL MATERIAL FOR ELECTRONICS


With each release of the latest handheld electronics, consumers have come to expect enhanced functionality, more powerful chipsets, and greater durability in devices that are also smaller and thinner. To maintain a competitive edge, product development teams need to find materials that enable or enhance next-generation technologies like 5G and virtual reality while managing the heat required to power devices.  

While stainless steel is commonly used in mobile devices because of its stiffness and strength, its poor conductivity requires additional materials to be used as heat spreaders to avoid battery hot spots. Adding the heat spreading material increases the overall size and weight of the device. To address this challenge, Materion created eStainless materials, which are thermally conductive, fully formable clad laminates made of stainless steel and copper (Cu) or aluminum (Al). eStainless clad Cu (SUS/Cu/SUS) is ideal as a high conductivity replacement for stainless steel, allowing heat spreading functionality to be designed directly into the structure of devices. eStainless clad Al (SUS/Al/SUS) can replace thicker aluminum components, allowing for device lightweighting without sacrificing strength or thermal requirements. Integrated heatsinks made of eStainless clad reduce the need to add specialty thermal management solutions, saving both costs and internal device space.

Read our in-depth product brief, which explains the thermal management and performance properties of eStainless clad compared with traditional stainless steel and graphite solutions. 

eStainless clad materials are ideally suited for frames, brackets, chassis and housings in electronics. With 10 to 18 times higher thermal conductivity than steel, and comparable strength and stiffness properties, eStainless clad materials can be integrated as a drop-in replacement with existing components. 

Download the eStainless Clad Data Sheet to learn more.



 

WATCH THE HEAT SPREADING PERFORMANCE OF ESTAINLESS CLAD

ESTAINLESS® CLAD STREAMLINES THERMAL MANAGEMENT 

Our eStainless clad materials serve a dual purpose in handheld devices, enabling thin, stiff, structural components that also conduct and dissipate heat. Compare the unique property benefits of both eStainless clad Cu and eStainless clad Al. 

eStainless – Copper eStainless – Aluminum
eStainless Copper Coil eStainless Aluminum Coil
  • Reduce z-height vs. stainless steel + graphite
  • Superior heat spreading properties
  • Mechanical performance rivaling solid steel
  • High stiffness-to-weight ratio for lightweighting
  • Improved heat spreading vs. stainless steel and graphite
  • Fully formable for stamping and drawing

Talk with our engineers to learn how eStainless clad can solve your thermal management challenges.