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ESTAINLESS® CLAD THERMAL MANAGEMENT SOLUTIONS FOR HANDHELD ELECTRONICS


Thermal management is a huge concern in consumer electronics design. Product development teams face growing pressure to add functionality and more powerful chipsets into space-limited devices without overheating or discomfort to the user. Innovative approaches to thermal management are needed in order to maintain a competitive edge.

Combining the strength of stainless steel with thermal properties of conductive aluminum or copper, Materion Technical Materials has paved the way for generations of lighter, cooler and thinner devices with eStainless.




ESTAINLESS® CLAD OUTPERFORMS STAINLESS STEEL + GRAPHITE

eStainless is a thermally conductive replacement for conventional stainless steels for use as chassis, case, frame, EMI or other structural metal components. eStainless allows designers to use the device structure itself to disperse thermal loads, conserving space by eliminating expensive heat spreaders such as graphite while simultaneously achieving cooler devices.

The key to eStainless clad is tapping into otherwise unused space in handheld devices. By replacing the under-utilized core of steel components with highly conductive metals, eStainless harnesses bulk thermal conductivity to spread heat. A fully formable clad laminate of stainless steel and aluminum (SUS/Al/SUS) or copper (SUS/Cu/SUS), eStainless maintains high stiffness with 10-15x greater conductivity. Compared to the addition of micron-scale oriented graphite films, eStainless can reduce cost, thickness, and weight.

Watch eStainless heat spreading in action

THE MECHANICAL AND THERMAL ADVANTAGES OF ESTAINLESS® CLAD

Why use materials that only do one thing? Materion's eStainless pulls double duty, enabling thin, stiff, structural members that also conduct heat to eliminate hot spots. Reduce z-height and gain valuable internal space by designing with eStainless.

eStainless – Aluminum eStainless – Copper
eStainless Aluminum Coil eStainless Copper Coil
  • High stiffness-to-weight ratio for lightweighting
  • Improved heat spreading vs. stainless steel + graphite
  • Fully formable for stamping and drawing
  • Reduce z-height vs. stainless steel + graphite
  • Superior heat spreading properties
  • Mechanical performance rivaling solid steel

Contact our engineers today to learn how eStainless can solve your thermal management challenges.