ESTAINLESS® CLAD: CONDUCTIVE STAINLESS MATERIAL FOR ELECTRONICS
With each release of the latest handheld electronics, consumers have come to expect additional and enhanced functionality, more powerful chipsets, and greater durability in devices that are also smaller and thinner. To maintain a competitive edge, product development teams need to find materials that enable or enhance next-generation technologies while managing the heat that these devices generate.
eStainless materials are thermally conductive, fully formable clad laminates of stainless steel and copper (SUS/Cu/SUS). The materials are ideal as high conductivity replacements for stainless steels, allowing heat spreading functionality to be designed directly into the structure of devices. Integrated heatsinks made of eStainless clad reduce the need to add specialty thermal management solutions, saving both costs and internal device space.
Read our in-depth product brief, explaining the thermal management and performance properties of eStainless clad.
eStainless clad materials are a better alternative to steels commonly used for frames, brackets, chassis and housings in electronics. With 12 to 18 times higher thermal conductivity than steel – and similar strength and stiffness properties – eStainless clad materials can be integrated as a drop-in replacement with existing components.
Download the eStainless Clad Data Sheet to learn more.
ESTAINLESS® CLAD STREAMLINES THERMAL MANAGEMENT
Our eStainless clad materials serve a dual purpose in handheld devices, enabling thin, stiff, structural components that also conduct and dissipate heat. Compare the properties of eStainless clad to the conventional materials commonly used in electronic devices such as steel, copper and steel with graphite.
|eStainless Clad – Copper|
Contact our engineers to learn how eStainless clad can solve your thermal management challenges.