Home Products Clad Metals Thermal Management Materials ESTAINLESS® CLAD THERMAL MANAGEMENT SOLUTIONS FOR HANDHELD ELECTRONICS Thermal management is a huge concern in consumer electronics design. Product development teams face growing pressure to add functionality and more powerful chipsets into space-limited devices without overheating or discomfort to the user. Innovative approaches to thermal management are needed in order to maintain a competitive edge. Combining the strength of stainless steel with thermal properties of conductive aluminum or copper, Materion has paved the way for generations of lighter, cooler and thinner devices with eStainless® clad materials. Download the eStainless Clad Data Sheet ESTAINLESS® CLAD OUTPERFORMS STAINLESS STEEL + GRAPHITE eStainless clad is a thermally conductive replacement for conventional stainless steels for use as chassis, case, frame, EMI or other structural metal components. eStainless clad allows designers to use the device structure itself to disperse thermal loads, conserving space by eliminating expensive heat spreaders such as graphite, while simultaneously achieving cooler devices. The key to eStainless clad is tapping into otherwise unused space in handheld devices. By replacing the under-utilized core of steel components with highly conductive metals, eStainless clad harnesses bulk thermal conductivity to spread heat. A fully formable clad laminate of stainless steel and aluminum (SUS/Al/SUS) or copper (SUS/Cu/SUS), eStainless material maintains high stiffness with 10-15 times greater conductivity. Compared to the addition of micron-scale oriented graphite films, eStainless can reduce cost, thickness, and weight. See heat spreading of Estainless® clad THE MECHANICAL AND THERMAL ADVANTAGES OF ESTAINLESS® CLAD Why use materials that only do one thing? Materion's eStainless clad pulls double duty, enabling thin, stiff, structural members that also conduct heat to eliminate hot spots. Reduce z-height and gain valuable internal space by designing with eStainless material. eStainless – Aluminum eStainless – Copper High stiffness-to-weight ratio for lightweighting Improved heat spreading vs. stainless steel + graphite Fully formable for stamping and drawing Reduce z-height vs. stainless steel + graphite Superior heat spreading properties Mechanical performance rivaling solid steel Contact our engineers to learn how eStainless clad can solve your thermal management challenges.