WIRE BONDABLE LEAD FRAME MATERIALS FOR AUTOMOTIVE ELECTRONICS
Materion’s lead frame materials incorporate stable wire bondable surfaces and conductive terminal alloys for signal and power management. Produced in reel-to-reel processes, these semi-finished lead frame materials enable large volume manufacturing of high reliability electronic packaging materials.
ALUMINUM INLAY CLAD FOR ULTRA-STABLE BONDING
Wire bonding forms the connection between microelectronic circuitry and the macro-scale wiring systems of your car. When reliability and high power linkages are critical to a control module, nothing is more robust or offers higher processing yields than bonding aluminum wire to aluminum pads. Integrating the aluminum pad directly into the lead frame via inlay cladding is the process of choice for safety critical applications, such as Electronic Power Steering Modules and Anti-Lock Brake Systems.
Aluminum inlay benefits:
- Superior reliability
- High temperature and vibration stability
- Extended shelf life
- Large wire bonding process windows and high yields
While copper alloys remain the most widely used base metal for lead frames, Materion now introduces a new, light-weight, cost-reducing alternative: High Strength Aluminum (HSA). Available with pure aluminum bond surfaces and electroplated terminals, our HSA alloy matches the conductivity and strength of traditional copper alloys.
Materion also offers a variety of electroplated lead frame designs, providing a cost-efficient solution for many electronic modules and sensors.
Electroplated nickel-phosphorous, for example, is available as overall or selective stripe plating and is commonly combined with other electroplated materials such as selective tin or silver for contact terminals.
Contact our metallurgists to learn more about aluminum Inlay and other lead frame material solutions for your automotive application.