Home Products Microelectronics Packaging Materials OUR FULL LINE OF MICROELECTRONIC PACKAGING MATERIALS DELIVERS PERFORMANCE We manufacture a full line of microelectronic packaging products for protection of electronic devices including high reliability hermetic lids, ceramic packages, preforms, and braze & solder alloys. Materion offers a wide variety of standard designs or products customized to your specifications. With our extensive microelectronic packaging expertise and global locations, we can fulfill any packaging requirements. HIGH RELIABILITY MICROELECTRONICS LIDS Materion is the leading supplier of hermetic lids for high reliability applications in semiconductor, MEMS, medical, hybrid and optical device industries. Our unique products enable a wide range of microelectronic packaging that can withstand harsh service environments and protect sensitive electronics from moisture. Offerings include: Combo-Lid™ covers Ceramic Combo-Lid™ overs Seam Seal-Lid™ covers, Micro-Lid covers™ & Solder Reflow Lid™ lids Getter Combo-Lid™ covers Visi-Lid™ lids Epo-Lid™ covers To see the variety of options, view our Lid Comparison Chart. SUPERIOR JOINING WITH OUR BRAZE AND SOLDER ALLOYS We produce braze and solder alloys for microelectronic packaging and high temperature joining of vacuum electronic devices in a variety of forms including ribbon, wire, preforms and powder. Materion manufactures “ultra clean” braze alloys and braze powders with base metals free of contamination that produce joints of high integrity and strength in pure and precious metals and alloys and a variety of shapes. Our product advantages include: Gold and silver alloys for excellent corrosion resistance Trace impurities severely limited to produce high purity braze and solder alloys Library tooled with over 5000 stamped preforms Wide range of melting temperatures for consistent performance Variety of alloys with superior thermal and electrical conductivity INNOVATIVE CERAMIC PACKAGING FOR MICROWAVE AND RF POWER TRANSISTORS Materion has developed unique ceramic packages to meet your demands for very low thermal resistance and very low RF loss for use with a wide variety of transistors and MMICs. Ceramic packaging is available in surface mount designs as well as bolt-down versions. Our products include: Ceramic Air Cavity Packages CuPack™ packages Plated Flanges CA-Pack™ packaging New designs fabricated to your device With our extensive tooling library and expertise, we can assist you in identifying the optimal microelectronic packaging materials for your application. Contact our technical team to discuss your needs.