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MICROELECTRONICS PACKAGING MATERIALS

For all your packaging needs!  Our product line includes: ceramic packages, hermetic lids, AuSn preforms & frames, lead-free solder alloys and braze alloys.

Our high reliability electronic packaging materials are manufactured in a wide variety of standard designs and can be customized to meet your specifications. With our extensive tooling library, microelectronic expertise and global locations, we are able to fulfill all your packaging requirements.

Contact Materion to discuss our microelectronic products and services.

BRAZE & SOLDER ALLOYS

Braze and Solder Alloys

We keep it together! For superior joining, try our high performance braze and solder alloys, available in a variety of custom forms, shapes & alloys.

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CERAMIC PACKAGING

Ceramic Packaging

RF & microwave packaging for very low thermal resistance and RF loss. Let us help you identify the correct product for your application.

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LIDS

Lids

We've got you covered! High performance lids for the semiconductor, MEMS, medical and optical markets. View Lid Comparison Chart.

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ELECTRICAL & THERMAL

Preforms

When concerned about electrical conductivity or thermal management, turn to us for custom clad products & electrical contact alloys.  

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