OUR FULL LINE OF MICROELECTRONIC PACKAGING MATERIALS DELIVERS PERFORMANCE

We manufacture a full line of microelectronic packaging products for protection of electronic devices including high reliability hermetic lids, ceramic packages, preforms, and braze & solder alloys. Materion offers a wide variety of standard designs or products customized to your specifications. With our extensive microelectronic packaging expertise and global locations, we can fulfill any packaging requirements.

HIGH RELIABILITY MICROELECTRONICS LIDS

Materion is the leading supplier of hermetic lids for high reliability applications in semiconductor, MEMS, medical, hybrid and optical device industries. Our unique products enable a wide range of microelectronic packaging that can withstand harsh service environments and protect sensitive electronics from moisture. Offerings include:

SUPERIOR JOINING WITH OUR BRAZE AND SOLDER ALLOYS

We produce braze and solder alloys for microelectronic packaging and high temperature joining of vacuum electronic devices in a variety of forms including ribbon, wire, preforms and powder. Materion manufactures “ultra clean” braze alloys and braze powders with base metals free of contamination that produce joints of high integrity and strength in pure and precious metals and alloys and a variety of shapes. Our product advantages include:

Gold and silver alloys for excellent corrosion resistance
Trace impurities severely limited to produce high purity braze and solder alloys
Library tooled with over 5000 stamped preforms
Wide range of melting temperatures for consistent performance
Variety of alloys with superior thermal and electrical conductivity

INNOVATIVE CERAMIC PACKAGING FOR MICROWAVE AND RF POWER TRANSISTORS

Materion has developed unique ceramic packages to meet your demands for very low thermal resistance and very low RF loss for use with a wide variety of transistors and MMICs. Ceramic packaging is available in surface mount designs as well as bolt-down versions. Our products include:

Ceramic Air Cavity Packages
CuPack™ packages
Plated Flanges
New designs fabricated to your device

With our extensive tooling library and expertise, we can assist you in identifying the optimal microelectronic packaging materials for your application. Contact our technical team to discuss your needs.