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CERAMIC PACKAGING

RF and microwave packages for use with a wide variety of RF power transistors and MMICs, including transistors fabricated in Si, GaAs and GaN.  As a leading innovator of ceramic packages, we can meet your demands for very low thermal resistance and very low RF loss. Our product line includes:

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OUR EXPERTS CAN IDENTIFY THE BEST SOLUTION FOR YOUR PACKAGING APPLICATION!
 

THE MATERION ADVANTAGE

Our engineers will partner with you to assist with selection of an optimal product for your RF device or fabricate new designs.

  • Packages available in surface mount designs as well as bolt-down versions
  • All packages are plated with electrolytic nickel and gold to meet exacting needs of the microelectronic industry
  • Unique patented CuPacks™ feature copper leads, a thin copper base, and are compatible with a wide range of die attach materials
  • Dozens of open-tooled designs that provide best-cost solutions
  • Can incorporate flanges of CuW, Cu-CuMo-Cu or other advanced materials for the high power density requirements of  RF power transistors