HIGH POWER RF CERAMIC AIR CAVITY PACKAGES FOR WIRELESS APPLICATIONS

For over 15 years, Materion has been a leader in the production of microelectronic packaging for a wide variety of RF power transistors. Our ceramic packages for discrete Si, GaAs and GaN transistors offer proven performance and reliability for wireless applications.

THE INDUSTRY STANDARD FOR SI AND GAN RF POWER TRANSISTORS

Our ceramic air cavity packages deliver consistently high-performance for transmission in the 500 MHz to 3.5 GHz frequency range. The brazed construction provides excellent mechanical reliability for use in microelectronic packaging designs that meet rigorous performance standards.

DESIGN ADVANTAGES MAXIMIZE BEST-COST SOLUTIONS

Materion has engineered our ceramic air cavity packages to increase their usefulness and value to our customers including:

• High thermal conductivity flange promotes low thermal resistance
• Alumina ring frames provide very low dielectric loss at RF frequencies
• Leads are Alloy 42, plated with Ni and Au to provide superlative electrical conduction
• Ni:Co + Au electrolytic plating is compatible with AuSi eutectic die attach or AuSn eutectic die attach

Our R&D team can assist with new product development or to customize ceramic packages for any of your demanding applications. Please contact our team for assistance with selecting appropriate ceramic air cavity packages or any of your microelectronic packaging needs.