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Wafer Level Packaging -  Low Cost Hermeticity

  • Potential Advantages of Wafer Level Packages relative to discrete packages
    • Lower cost per hermetic enclosure
    • No need for an expensive, cofired ceramic package
    • Compatible with semiconductor wafer processing
    • Die attach, wire bond or solder bump bonding, wafer bonding, singulation, pick and place positioning can all be automated

Wafer Level Packaging -  Low Cost Hermeticity