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The right backing plate is critical to your sputtering process!

Materion can assist you in selecting the best backing plate for your application. Considerations include the individual physical properties of the target and plate and their expected operating temperatures. 


Typical backing plate materials include: Copper, Copper Alloys, Aluminum and Molybdenum  

Backing plates may be purchased singly or with sputtering targets or associated services such as precision parts cleaning, precious metal refining or target bonding. The combination of our material and service offerings provide you with the lowest Total Cost of Ownership for your sputtering process.

CONTACT US for details on backing plates, sputtering targets & other services.

Target Bonding
We also offer sputtering target bonding services to bond sputtering targets to backing plates. Our process provides precise target-backing plate alignment for proper fit in the cathode and nondestructive ultrasonic testing to certify bond integrity. 


A partial list of equipment platforms we routinely manufacture for includes:

> Anelva   > Applied Materials   > Aviza    > CVC
> Evatec   > KDF   > Leybold   > NEXX
> Novellus   > Perkin-Elmer   > SFI   > Singulus
> Tango Systems   > Temescal   > Trikon   > Unaxis
> Varian    > Veeco