CHOOSING THE RIGHT BACKING PLATE IS CRITICAL

There are a number of criteria to consider in selecting a backing plate for targets in the thin film deposition process. Materion backing plates, will:

• Adhere well to the target
• Enhance the mechanical strength of the target
• Facilitate the cooling of the target and target assembly
• Require good electrical contact between a sputtering target and backing plate
• Permit good heat conduction
• Be available in standard and custom configurations

Considering the factors in making the correct choice, a customer could benefit from some guidance. Materion’s technical experts can assist in identifying the right backing plate for your application.

RECOMMENDED MATERIALS & OEM PLATFORMS SERVICED

When choosing backing plate materials, individual physical properties of the target and plate must be taken into consideration as well as their expected operating temperatures. Materion supplies Copper, Copper Alloys, Aluminum and Molybdenum backing plates.

MULTIPLE OEM PLATFORMS SUPPORTED

A partial list of equipment platforms we routinely manufacture for includes:

COMBINING PRODUCTS & SERVICES FOR A COMPLETE SOLUTION

Materion’s backing plates may be purchased individually or in combination with sputtering targets and associated services such as target bonding, precision parts cleaning or precious metal refining. The combination of our thin film deposition materials and services provide you with the lowest Total Cost of Ownership for your sputtering process.

Our superior target bonding service provides precise target-backing plate alignment for proper fit in the cathode and nondestructive ultrasonic testing to certify bond integrity. It delivers a bond with high thermal and mechanical integrity to ensure optimum sputtering performance.

Discover the difference our backing plates can make! Contact Materion to discuss how a combination of thin film deposition products and services can save you money.