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STRONGER BONDING DELIVERS IMPROVED SPUTTERING PERFORMANCE


Materion’s Silvertech PT-1 is a two-part, conductive silver-filled epoxy that replaces metallic bonding for high-temperature sputtering operations. Our popular formulation precisely balances the ratio of silver powder and epoxy resin to create better bonding for electronic and optoelectronic applications.

SILVERTECH PT-1 EPOXY OFFERS ADVANTAGES

Materion’s multi-purpose silver-filled epoxy is suitable for a variety of bonding applications, and provides many advantages such as:

  • Maximizing thermal & electrical conductivity to ensure optimal processing performance
  • Creating a strong mechanical bond to prevent premature sputtering target failure
  • Improving the oxidation resistance
  • Available in single-use kits based on target size to ensure long-lasting bond strength

DISTINCTIVE MATERIAL PROPERTIES OF SILVERTECH PT-1 EPOXY

The following chart shows some of the properties of our silver-filled epoxy that allow it to provide better bonding and longer shelf life.

Property

Value

Volume Resistivity

Less than 0.001 ohm-cm

Room Temperature Cured

0.003 ohm-cm @25OC

Heart Cured, ½ hr @ 150O

0.005 ohm-cm @25OC

Tensile Shear Strength

1200 psi @25OC

Shelf Life (Sealed Container)

4-5 mos @ 25OC

Pot Life (After Mixing)

~1 hr @25OC

Thermal Conductivity

1.046 x 10-2 w/cm-OC

Operating Temperature Range

-60OC to 175OC

Contact Materion Engineers and discuss how Silvertech PT-1 Epoxy can improved performance in your sputtering operations.and discuss how Silvertech PT-1 Epoxy can improved performance in your sputtering operations.