STRONGER BONDING DELIVERS IMPROVED SPUTTERING PERFORMANCE
Materion’s Silvertech PT-1 is a two-part, conductive silver-filled epoxy that replaces metallic bonding for high-temperature sputtering operations. Our popular formulation precisely balances the ratio of silver powder and epoxy resin to create better bonding for electronic and optoelectronic applications.
SILVERTECH PT-1 EPOXY OFFERS ADVANTAGES
Materion’s multi-purpose silver-filled epoxy is suitable for a variety of bonding applications, and provides many advantages such as:
- Maximizing thermal & electrical conductivity to ensure optimal processing performance
- Creating a strong mechanical bond to prevent premature sputtering target failure
- Improving the oxidation resistance
- Available in single-use kits based on target size to ensure long-lasting bond strength
DISTINCTIVE MATERIAL PROPERTIES OF SILVERTECH PT-1 EPOXY
The following chart shows some of the properties of our silver-filled epoxy that allow it to provide better bonding and longer shelf life.
|
Property |
Value |
|
Volume Resistivity |
Less than 0.001 ohm-cm |
|
Room Temperature Cured |
0.003 ohm-cm @25OC |
|
Heart Cured, ½ hr @ 150O |
0.005 ohm-cm @25OC |
|
Tensile Shear Strength |
1200 psi @25OC |
|
Shelf Life (Sealed Container) |
4-5 mos @ 25OC |
|
Pot Life (After Mixing) |
~1 hr @25OC |
|
Thermal Conductivity |
1.046 x 10-2 w/cm-OC |
|
Operating Temperature Range |
-60OC to 175OC |