TANTALUM SPUTTERING TARGET PLATE FOR THIN FILM MANUFACTURING

Tantalum (Ta) is a refractory metal critical to the architecture of microchips for the high growth semiconductor industry. High purity Ta targets are used to sputter microscopic thin layers of tantalum on silicon wafers, enabling the manufacturing of next generation semiconductor logic chips, including DRAM and 3D-NAND memory chips, with advanced node architectures and higher performance.

INDUSTRY-LEADING TECHNICAL PROPERTIES OPTIMIZE YOUR PVD PROCESS

The decades of experience in high-volume production of texture-controlled tantalum for sputtering targets resulted in manufacturing of disks with exceptionally consistent properties, enabling end-users to benefit from:

• Chemistry control to parts per billion
• High quality deposited films (uniform thickness, resistivity)
• Customized deposition rates for optimal sputtering performance

Materion Corporation uses only ethically sourced tantalum from RMAP-certified conformant sources. Proactive recycle streams were developed over the years resulting in advanced processes in line with the company’s overall policies towards sustainable developments and a green future.

TANTALUM SPUTTERING TARGET APPLICATIONS 

Materion supports a variety of applications to fulfill your needs:

Key applications for tantalum sputtering targets include memory, logic, RF & power devices, and read/write heads for hard disk drives. Many of these applications require extreme purity (> 99.995%) with chemical and metallurgical uniformity. Materion consistently provides these materials to provide the best performance for physical vapor deposition rates and consistency.

Typical Applications:

Could your manufacturing benefit from the expertise of the world leaders in tantalum sputter target plates? Please contact our Customer Support Team to find out details of your application, and we will contact you as soon as possible.