Home Resource Center Product Data and Related Literature Microelectronics Packaging Materials RF Packaging Product Data Sheets RF Packaging Product Data Sheets Materion has developed a wide range of ceramic packages to meet your demands for low thermal resistance. Our products also provide very low RF loss for RF and microwave microelectronics packaging. We can incorporate flanges of advanced materials to achieve the high power density requirements of RF power transistors. Download product data today. Don't see what you need? Contact our microelectronics packaging experts for more information. Brazed RF Package - RF701 The RF701 package is an industry standard outline that offers proven performance and reliability. This cost-effective, 2 leaded device, is an excellent platform for wireless applications. Brazed RF Package - RF705 The RF705 package is an industry standard outline that offers the optimum combination of performance, price, and reliability. This package features a large cavity with high thermal conductivity that accommodates large, high-powered die. Brazed RF Package - RF707 The RF707 package is an industry standard outline that offers the optimum combination of performance, price, and reliability. This package is a 4 leaded package ideally suited for high power push-pull applications. Brazed RF Package - RF708 The RF708 package is an industry standard outline that offers the optimum combination of performance, price, and reliability. The RF708 is a 2-leaded package with a cavity that is sized to accommodate extra matching circuitry. Brazed RF Package - RF710 The RF710 package is an industry standard outline that offers the optimum combination of performance, price, and reliability. The RF710 is a 2-leaded package with one of the largest cavities available in a standard package outline. Brazed RF Package - RF711 The RF711 package is an industry standard outline that offers the optimum combination of excellent thermal performance, price, and reliability. The RF711 is a 2-leaded package that is well suited for the high power RF applications. Brazed RF Package - RF712 The RF712 package is an industry standard outline that offers the optimum combination of performance, price, and reliability. The RF712 is designed to accommodate push-pull devices and has excellent thermal performance over the entire standard temperature range. CuPack RF Package - PF018 The PF018 offers the optimum combination of performance, reliability, and assembly costs. Microwave power device manufacturers now have the option to use the highly reliable PF018 package as an alternative to low temperature plastic packages. CuPack RF Package - PF024 The PF024 offers the optimum combination of performance, reliability, and assembly costs. The shallow .010 in. cavity of this package allows for optimum wire bond lengths accommodating high frequency power applications. Microwave power device manufacturers have the option to use the highly reliable PF024 package as an alternative to low temperature plastic packages. CuPack RF Package - PF083 The PF083 offers the optimum combination of performance, reliability, and assembly costs. Microwave power device manufacturers have the option to use the highly reliable PF083 package as an alternative to low temperature plastic packages. CuPack RF Package - PF130 The PF130 offers the optimum combination of performance, reliability, and assembly costs. Microwave power device manufacturers have the option to use the highly reliable PF130 package as an alternative to low temperature plastic packages. Ultra Pack RF Package - UP501 UP501 is a high-performance metal/ceramic package for use in RF and microwave power semiconductor devices. This package exceeds industry standards for thermal dissipation for higher power devices. Ultra Pack RF Package - UP504 UP504 is a high-performance metal/ceramic package for use in RF and microwave power semiconductor devices. This package exceeds industry standards for thermal dissipation and is a drop in replacement for the industry outline.
