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RF Packaging Product Capabilities Brochure

Materion developed a range of ceramic packages to meet your demands for low thermal resistance. Our products also provide very low RF loss for RF and microwave microelectronics packaging. We can also incorporate flanges of advanced materials to achieve the high power density requirements of RF power transistors. 

Download our product capabilities brochure today. Don't see what you need? Contact our microelectronics packaging experts for more information. 

  1. PDF icon RF Packaging Product Capabilities Brochure

    Download Materion's RF Packaging capabilities brochure today.