Sputtering Target Bonding

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PROVIDING SERVICES FOR OPTIMUM PERFORMANCE

Materion provides sputtering target bonding services for a variety of traditional and custom alloy materials that deliver a bond with high thermal and mechanical integrity to ensure optimum sputtering performance. Our bonding processes include solder bonding, diffusion bonding and other proprietary methods of high-temperature bonding.

ROBUST SPUTTERING TARGET BONDING SERVICES

Materion provides outstanding service at our strategically located target bonding service centers, which includes:

  • Sputtering target backing plate cleaning and resurfacing for superior adhesion
  • 100% target-backing plate alignment for proper fit of the cathode
  • Sputtering target stocking programs for quick turnaround on rebonded targets
  • Superior bond processes and analytic imaging for virtually void-free sputtering target bonds

DELIVERING OUTSTANDING SERVICES AND SUPPORT

Materion provides sputtering target bonding services to help customers manage metals for optimal returns. Our technical experts are available to assist customers in identifying the optimal materials solution.

Contact Our Team to learn more about our sputtering target bonding services.