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INNOVATION IN HERMATIC LID DEVELOPMENT AND PERFORMANCE


Whatever your microelectronic packaging requirements, Materion’s product line encompasses a broad range of hermetic lids. View our lid comparison chart to see the best choice for sealing your electronic device. Our hermetic cover lids can be customized for applications in the semiconductor, MEMS, medical or optical market. Our lids are able to meet the demand of RF and microwave packages for very low thermal resistance and very low RF loss.

SUPPLYING THE WORLD WITH HERMETIC COVER LIDS

Sensitive electronics must be adequately protected by secure packaging. With our expertise in microelectronic packaging and hermetic lids, we provide these benefits:

  • High reliability products that deliver optimal performance
  • Extensive tooling library with multiple size solder preforms and cover lids
  • Specializing in precious metal alloys to complement your solder applications
  • Can support most configurations, applications and volume requirements
  • Convenient operations in N. America, Singapore and the Philippines

INNOVATIVE LINE-UP OF MICROELECTRONIC LIDS

Whether you require non-hermetic or hermetic lids for semiconductor, MEMS, medical or optical applications, we have lid options to shield electronic devices from moisture and contamination including:

Need some help in selecting the right microelectronic packaging for your application? Contact one of our engineers for expert guidance.