Home Products Microelectronics Packaging Materials Hermetic Packaging Lids INNOVATION IN HERMETIC LID DEVELOPMENT AND PERFORMANCE Whatever your microelectronic packaging requirements, Materion’s product line encompasses a broad range of hermetic lids. View our lid comparison chart to see the best choice for sealing your electronic device. Our hermetic cover lids can be customized for applications in the semiconductor, MEMS, medical or optical market. Our lids are able to meet the demand of RF and microwave packages for very low thermal resistance and very low RF loss. SUPPLYING THE WORLD WITH HERMETIC COVER LIDS Sensitive electronics must be adequately protected by secure packaging. With our expertise in microelectronic packaging and hermetic lids, we provide these benefits: High reliability products that deliver optimal performance Extensive tooling library with multiple size solder preforms and cover lids Specializing in precious metal alloys to complement your solder applications Can support most configurations, applications and volume requirements Convenient operations in N. America, Singapore and the Philippines INNOVATIVE LINE-UP OF MICROELECTRONIC LIDS Whether you require non-hermetic or hermetic lids for semiconductor, MEMS, medical or optical applications, we have lid options to shield electronic devices from moisture and contamination including: Combo-Lid™ covers - for high reliability applications Micro-Lid™ covers - for packages smaller than .300 in Seam Seal-Lid™ lids - for sealing heat sensitive electronics Solder Reflow-Lid™ covers - a cost alternative to the Combo-Lid™ Visi-Lid™ covers and Visi-Caps - for optical packages and sensor applications Etch Lid™ covers - for low temperature hermetic lid sealing Getter Combo-Lid™ covers – for packages that require the cavity be free of all gases Ceramic Combo Lid™ lids - for specialty applications Non-Magnetic Lids – for specialty applications Epo-Lid™ covers - Epoxy-coated ceramic non-hermetic lid for commercial applications Epoxy MEG 150 & MEG 165 – Epoxy with strong adhesion for non-hermetic applications Need some help in selecting the right microelectronic packaging for your application? Contact one of our engineers for expert guidance.