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PATENTED HERMETIC COVER LID FOR MICROELECTRONIC PACKAGING


When hermetic cover lids that can function in the harshest environments are required , Materion’s patented Combo-Lids™ deliver superior sealing to protect high reliability applications in semiconductor, MEMS, crystal oscillator, medical and optical devices from moisture and particulates.

HIGH-PERFORMANCE KOVAR™ ALLOY INHIBITS CORROSION

The base metal of our Combo-Lids™ is Kovar™ (Alloy 42) which is plated with nickel and gold flash and then tack-welded to a solder preform, usually AuSn (gold-tin) eutectic. The nickel layer inhibits corrosion, while the precious metal (gold) layer promotes solderability and ensures a clean particulate-free surface. Tack-welding the solder preform to the lid conveniently aligns the solder to the perimeter of the lid, simplifying handling and reducing part count. Therefore, Hermetic Combo-Lids™ offer a best-cost solution.

PERSONALIZED ASSISTANCE ON LID & FRAME COMPOSITION

We have extensive experience in microelectronic packaging for sensitive electronic devices. Our hermetically sealed Combo-Lids™ and frames are available in a range of standard dimensions and tolerances. Our engineers can also offer guidance for customized hermetic cover lid design, frame composition and related tooling.

Lid Composition

  • Length & width dimension tolerance +/-.003”
  • Thickness dimension tolerance +/-.001” with Flatness <.001”for=””lids=””> <.500” or=””.002=”” for=””lids=””>.500”,burrs<>

Lid Frame

  • Length & width dimension tolerance +/-.003”
  • Thickness dimension tolerance +/-.0003”

BENEFITS OF MATERION’S COMBO-LIDS™

In addition to superior sealing of microelectronic packaging, our hermetic cover lids are designed and manufactured with other customer advantages, including:

  • Recommend process parameters that ensure maximum assembly line yields
  • Lids and preforms are available individually
  • Lids are produced in the United States, Singapore and the Philippines for near-source distribution

OUR ENGINEERS OFFER SUPERIOR CUSTOMER SUPPORT

Let Materion help identify the optimal Combo-Lid™ for your specific microelectronic packaging application. Contact our engineers to discuss your requirements.