Home Products Microelectronics Packaging Materials Hermetic Packaging Lids Combo-Lids™ PATENTED HERMETIC COVER LID FOR MICROELECTRONIC PACKAGING When hermetic cover lids that can function in the harshest environments are required , Materion’s patented Combo-Lid™ covers deliver superior sealing to protect high reliability applications in semiconductor, MEMS, crystal oscillator, medical and optical devices from moisture and particulates. HIGH-PERFORMANCE KOVAR™ ALLOY INHIBITS CORROSION The base metal in our Combo-Lid covers is Kovar™ metal (Alloy 42) which is plated with nickel and gold flash and then tack-welded to a solder preform, usually AuSn (gold-tin) eutectic. The nickel layer inhibits corrosion, while the precious metal (gold) layer promotes solderability and ensures a clean particulate-free surface. Tack-welding the solder preform to the lid conveniently aligns the solder to the perimeter of the lid, simplifying handling and reducing part count. Therefore, Hermetic Combo-Lid™ covers offer a best-cost solution. PERSONALIZED ASSISTANCE ON LID & FRAME COMPOSITION We have extensive experience in microelectronic packaging for sensitive electronic devices. Our hermetically sealed Combo-Lid™ covers and frames are available in a range of standard dimensions and tolerances. Our engineers can also offer guidance for customized hermetic cover lid design, frame composition and related tooling. Lid Composition Length & width dimension tolerance +/-.003” Thickness dimension tolerance +/-.001” with Flatness <.001”for=””lids=””> <.500” or=””.002=”” for=””lids=””>.500”,burrs<> Lid Frame Length & width dimension tolerance +/-.003” Thickness dimension tolerance +/-.0003” BENEFITS OF MATERION’S COMBO-LIDS™ In addition to superior sealing of microelectronic packaging, our hermetic cover lids are designed and manufactured with other customer advantages, including: Recommend process parameters that ensure maximum assembly line yields Lids and preforms are available individually Lids are produced in the United States, Singapore and the Philippines for near-source distribution OUR ENGINEERS OFFER SUPERIOR CUSTOMER SUPPORT Let Materion help identify the optimal Combo-Lid™ cover for your specific microelectronic packaging application. Contact our engineers to discuss your requirements.
