LOW TEMPERATURE LID SEALING FOR UNIQUE HERMETIC APPLICATIONS
While it is critical that semiconductor packages have a reliable hermetic cover to protect sensitive contents, some chips will not tolerate high temperatures during soldering. For those circumstances, a low temperature seam sealing process is necessary. Materion offers its innovative Etch Lid™ cover, a solution for hermetic applications where the chips are unable to withstand solder reflow temperatures in an oven.
SEAM WELDING PROCESS & ASSEMBLY ENHANCE STRENGTH
Etch Lid™ lids are composed of Kovar, steel and other alloys, and are used in the seam welding process to melt and fuse the thinner edges of the lids onto a metal seal ring. This concentrates the greatest heat at the perimeter of the lid to enable a weld onto the metal seal ring. Alternatively, Materion can affix a solder preform onto the outer lip of the lid, to enable solder reflow to the sealing surface. The insertion of a solder enables a wider range of lid materials (including Mo) and a wider range of sealing surfaces (including metallized ceramic). The same seam sealing equipment can be used to melt the solder instead of weld the Kovar lid.
OVER 8,000 PREFORM SHAPES FOR TACK WELDING
The lid material, typically Kovar or steel, can be welded to the seal ring beneath it, or a solder preform can be placed at the perimeter of the lid to enable localized melting of the solder onto the seal ring. Materion manufactures lids and solder preforms in a variety of shapes, sizes and configurations to meet customer requirements including:
- Disks & Rectangles
- Squares & Frames
- Rounds & Rings
- Irregular & Complex
- Custom Shapes
CHOICE OF MATERIALS CAN MINIMIZE COST
While gold-tin solder alloys create superior hermetic seal without flux, customers may prefer a lid with minimal precious metal content in order to reduce cost. Materion produces several solder alloys to achieve optimal packaging solutions for your application without surrendering hermeticity.
CUSTOMIZED HERMETIC LID DESIGNS FOR EVERY APPLICATION
Materion is the industry’s microelectronic packaging cover lid innovator. We can design and manufacture Etch Lids™ and Solder Frames from your drawing or dimensions. We also offer a product line that encompasses a broad range of lids for every need.
For assistance in selecting the right hermetic lid for your packaging application please contact one of our lid experts for guidance.