Home Products Microelectronics Packaging Materials Hermetic Packaging Lids Seam Seal-Lids™, Micro Lids™ , Solder Reflow-Lids™ UNIQUE HERMETIC LIDS FOR A WIDE RANGE OF MICROELECTRONIC APPLICATIONS Materion’s specialized hermetic lids are designed to protect heat sensitive electronics. We offer customized solder, plating and clad properties to meet customers’ individual needs. Our microelectronic packaging products are manufactured in a wide variety of designs. Three proprietary lid designs are Seam Seal-Lid™ covers, Micro-Lid™covers, and Solder Reflow-Lid™ covers. Micro-Lid™ Covers These hermetic lids are designed for smaller microelectronic packages with characteristics including: Packages with area 0.300 inches or less Base metal is Kovar or Alloy-42 for high performance A42 is plated with several layers, including 35-50 micro-inches of gold Due to their small size, capillary action pulls liquid solder to perimeter during reflow Highly corrosion-resistant for maximum protection An economic cost alternative to our traditional Combo-Lid™ cover, but with the same quality See our Lid Comparison chart to help select the right product for you. Seam Seal-Lid™ Covers These hermetic lids are known as an electroless Nickel-plated lid with characteristics including: Typical dimensions for standard lids range from .50 square inches to .060 square inches Base metal is Kovar or Alloy 42 for high performance A42 is plated with 50-200 micro inches of electroless nickel Highly corrosion-resistant for maximum protection Vast tool library allows us to stamp lids in a variety of sizes and shapes Solder Reflow-Lid™ Covers These hermetic lids are composed with non-precious metal solders and characteristics including: Typically used for lids that measure less than .200” x .200” Solder coverge controlled to the lid edge, so it easily passes gross leak tests Can be adjusted to accommodate lead-free solders An economic cost alternative to our traditional Combo-Lid™ cover, but with the same quality HIGHLY RELIABLE HERMETIC SEALING Materion’s microelectronic packaging is employed by a range of industries from semiconductor, MEMS, medical and optical. Following are some of the advantages and specifications for our hermetic lids. When you have a requirement for a specialized hermetic lid, consult with a Materion engineer to see if Seam Seal-lid™covers, Micro-Lid™ covers or Solder Reflow-Lid™ covers would work for your application.